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Abstract
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The deposition ofmetals on the ceramic particles has attractedmany attentions in recent years,which
cause betterwettability of ceramics during casting ofmetalmatrix composites. In this study, the effect of
electroless parameters have been investigated on theamount ofmass gain during deposition of copper
on the SiCparticles. For this purpose, pH, bath temperature, and particle sizewere considered as the
process parameters. Scanning electronmicroscopy was used for characterizing the deposited particles.
In addition, response surfacemethod andDesign Expert softwarewere used for optimizing the process
parameters. The results revealed that the particle size hadmore effect on themass gain compared to the
pHand bath temperature.Decreasing particle size and increasing bothpHand bath temperature caused
largeramount ofmass gain.The best condition for the electroless deposition of the copper on the SiC
ceramic particles was determined as particle size of 10 μm, bath temperature of 60 °C, and pHof 10.
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