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Abstract
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Pure copper and Cu-Zn plateswere friction stirwelded under the samecondition to evaluate the effect of stacking
fault energy on the microstructural evolution andmechanical properties of the joints. For this aim, microstructure
and texture of the joints were systematically characterized by electron backscattered diffraction and transmission
electron microscopy. Moreover, to study the mechanical properties of the different microstructural zones
of the joints, nanoindentation tests were employed. The results showed that in pure copper, continuous dynamic
recrystallizationwas the only restoration mechanismfor the formation of newgrains. By adding zinc into copper,
namely decreasing stacking fault energy, both continuous and discontinuous dynamic recrystallization mechanisms
occurred. To this end, the effect of stacking fault energy on the restoration mechanisms has been summarized
by schematic models. Moreover, the effect of the restoration mechanisms on the yield strength and strain
hardening behavior of the joints has been scrutinized.
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