مشخصات پژوهش

Creep behavior of double lap adhesively bonded joints was investigated using experimental tests and numerical analysis. Firstly, uniaxial creep tests were carried out to obtain the creep characteristics and constitutive parameters of the adhesive at different stress and temperature levels. Generalized time hardening model was used to predict the creep behavior of the adhesive. This model was modified to simulate the creep behavior at different stress and temperature levels. Secondly, the developed model was used to simulate the creep behavior of bonded joints using finite element based numerical analysis. Creep deformations of the joints were measured experimentally and good agreement was observed in comparison with the results obtained using numerical simulation. Afterward, stress redistribution due to the creep along the adhesively bonded joint was obtained numerically. It was observed that temperature level had a significant effect on the stress redistribution along the adhesive thickness.